- About ICSSD 2025 -

2025 International Conference on Smart Manufacturing, Structural Health Monitoring and Digital Twin

2025 International Conference on Smart Manufacturing, Structural Health Monitoring and Digital Twin (ICSSD 2025) will be held from June 26-28, 2025, in Dongguan, China. This event will gather top experts, scholars, and industry leaders from around the world. The conference aims to promote the development of smart manufacturing and structural health monitoring technologies, and to facilitate the application and innovation of digital twin technology. ICSSD 2025 will conduct in-depth discussions on cutting-edge technologies in smart manufacturing, methods and implementations of structural health monitoring, as well as the theories and practices of digital twins. Participants will have the opportunity to share their latest research findings, exchange groundbreaking ideas, and explore innovative applications across multiple disciplines. Additionally, the conference will feature keynote speeches and workshops to foster closer collaboration between academia and industry.

We sincerely invite researchers and engineers from around the world to attend and jointly explore the future development directions of smart manufacturing and structural health monitoring, promoting sustainable societal development. ICSSD 2025 looks forward to gathering with you to embrace the challenges and opportunities of the intelligent era!

▶ Submission

 Please send the full paper(word+pdf) to Submission System : 

Submission (Chinese)

Submission  (English)

For more information, please click: Submission

▶ Registration

Access the registration system, Fill information and pay online. : 

Registration (Chinese)

Registration  (English)

For more information, please click: Registration

▶ Call For Papers

The topics of interest for submission include, but are not limited to:

Call for Papers

Templates: Downloads

▶ Publication

 All papers will be reviewed by two or three expert reviewers from the conference committees. After a careful reviewing process, all accepted papers will be published inIOS Advances in Transdisciplinary Engineering(ISSN: 2352-751X), and submitted to EI Compendex, Scopus for indexing.

All submitted articles should report original results, experimental or theoretical, not previously published or being under consideration for publication elsewhere. Articles submitted to the conference should meet these criteria. We firmly believe that ethical conduct is the most essential virtue of any academics. Hence, any act of plagiarism or other misconduct is totally unacceptable and cannot be tolerated.